224G PAM4 internal MCIO cables for 1.6T aggregate AI bandwidth
PCIe Gen 7.0 system-level interconnects for high-density AI clusters
Linear Interconnect (LACC) for 200G/lane low-power AI server links
CXL 4.0 coherent memory expansion cables for 100TB+ pooled memory
Near-ASIC flyover assemblies with integrated cold plate for 224G PAM4
Internal Active Copper Cable (ACC) MSA compliant links for 1.6Tb nodes
Ultra-thin 0.8mm pitch internal twinax for 145GHz AI test environments
Immersion-cooling rated PCIe 6.0/7.0 cables for 100kW+ AI racks
Zero-latency linear analog equalization (LAE) cables for agentic AI
Vietnam-manufactured Section 301 exempt 1.6T cables for US data centers
G.657.A2 bend-insensitive internal fiber engine for 3.2T AI backplanes
High-density SFF-TA-1016 (MCIO) cables for rack-scale AI fabrics
Custom overmolded internal twinax for space-constrained AI accelerators
Non-China sourcing for IPC-A-620 Class 3 internal AI server links
Landed-cost optimized 1.6T internal cables from Vietnam factory hub
1.6T & 224G PAM4 Internal Interconnects | PCIe 7.0 & CXL 4.0 Solutions by SINNHONG
As of April 2026, the industry has shifted from board-level design to System-Level Architectures optimized for Agentic AI. SINNHONG, a premier China & Vietnam Manufacturer, leads this transition with our 1.6T Internal Server Cable Assemblies. Engineered to handle 224G PAM4 signaling and the extreme 128GT/s throughput of CXL 4.0, our cables eliminate the data bottlenecks in massive AI memory pools.
Adhering to the IPC-A-620 Class 3 Standard, SINNHONG provides the "nervous system" for 1.6T GPU-to-GPU fabrics. By leveraging our Vietnam-based production hub, we offer North American Tier-1 OEMs a strategic Section 301 Tariff Exempt supply chain. From Linear Active Copper (LACC) with analog equalization to Near-ASIC flyover solutions, our OEM Electronics Manufacturing ensures your AI hardware achieves maximum signal integrity with Landed-Cost Optimization.
Technical Matrix: 1.6T / 224G / LACC / CXL 4.0 Ready
| Feature | Technical Specification | Compliance & Standards |
| Data Throughput | 1.6T Aggregate / 224G PAM4 per lane | IEEE 802.3dj / PCIe 7.0 |
| Active Tech | Linear Active Copper (LACC) / ACC MSA | Zero-Latency Analog Path |
| Interface Types | MCIO (SFF-TA-1016), Gen-Z, CXL 4.0, OSFP | SFF-TA-1002 / 1016 |
| Cable Durability | Immersion-Cooling & Dielectric Fluid Stable | Fluoropolymer Insulation |
| Signal Integrity | <2dB Loss @ 53GHz (112G/224G Support) | High-Fidelity Twinax |
| Thermal Mgmt | Integrated Cold Plate Compatible (Optional) | 100kW Rack Optimization |
| Manufacturing Std | IPC-A-620 Class 3 / IATF 16949:2026 | Enterprise AI Grade |
| Supply Chain | SINNHONG Vietnam (Tariff-Exempt Hub) | US Section 301 Mitigation |
Precision Interconnects for the 2026 Agentic AI Revolution
1.6T & 224G PAM4 Dominance: Our cables are optimized for the 200G/lane transition, utilizing high-precision twinax to support 1.6Tb/s aggregate bandwidth in 1U spacing.
Linear Interconnect (LACC) Innovation: We lead the shift toward analog-based solutions, providing near-zero latency signal reach extension that consumes significantly less power than digital retimers—ideal for scaling AI clusters.
CXL 4.0 & Memory Pooling: Fully compliant with the CXL 4.0 specification, our cables enable 100+ TB memory pools with cache coherency across multi-rack AI infrastructures.
Vietnam Hub for Global Compliance: Our Vietnam facility enables US hyperscalers to execute a Non-China Sourcing Strategy, ensuring Duty-Free access to mission-critical PCIe 6.0/7.0 components.
Advanced High-Density Routing: Featuring 0.8mm pitch components and flat-ribbon designs, our cables optimize airflow in space-constrained AI chassis while maintaining 145GHz signal characterization.
1.6T GPU Super-Clusters: Internal high-speed links for next-generation AI accelerators within multi-rack training pods (e.g., NVLink 5 / UALink architectures).
CXL Disaggregated Memory: CXL 4.0 internal interconnects connecting CPUs to coherent memory expansion for massive-scale AI inference.
Near-ASIC Flyover Connectivity: Internal flyover assemblies that route 224G signals from the processor directly to the front panel, bypassing lossy PCB materials.
Liquid-Cooled AI Nodes: Specialized twinax with integrated cold plate support for servers utilizing direct-to-chip or immersion cooling.
Precision Test Environments: High-performance internal cables for 6G research and AI backhaul validation beyond 110GHz.
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